SDF181A/B-S Epoxy Adhesive

ADHESIVES

SDF181A/B-S Epoxy Adhesive

SDF181A/B-S is a solvent-free, environmentally friendly epoxy adhesive designed for room-temperature curing. After curing, it forms a medium-hardness layer that is highly resistant to impact, vibration, corrosion, and temperature fluctuations. It offers excellent bonding performance across a wide range of materials—from food-contact products to electronic components.

Description and Application

This adhesive is ideal for applications requiring high durability and flexibility. It is particularly well-suited for automotive body production using XPS bonded with fiberglass, electrical insulation and potting, and the bonding of metals, ceramics, rubber, glass, fibers, and food-grade components.

Applications

Automotive Industry: Used in the production of car bodies with XPS and fiberglass composites.
Food Industry: Safe for bonding materials in products that come into contact with food.
Electronics: Excellent for insulation and potting of electronic components.
Multi-material Bonding: Suitable for bonding glass, ceramics, metal, rubber, and fibers.

Technical Specifications

Property	Value
Hardness (Shore D)	80–82
Dielectric Strength (KV/mm)	20–22
Tensile Strength (Kg/mm²)	22
Volume Resistivity (Ohm·cm³)	1 × 10¹⁵
Surface Resistivity (Ohm·cm²)	1.2 × 10¹⁵
Heat Resistance (°C)	105
Water Absorption (% / 24 hrs at 25°C)	<0.03
Shrinkage (%)	<0.35
Compressive Strength (Kg/mm²)	20 – 25

Packaging
Securely packaged for safe transport and storage.

Storage & Shelf Life
Store in a cool, dry place.
Keep away from sunlight and humidity.

Notes
SDF181A/B-S Epoxy Adhesive offers strong bonding, corrosion resistance, and multi-industry versatility, making it an excellent solution for automotive, electronics, and food-grade applications.
For more details and custom solutions tailored to your project needs, please contact us.

Updated on 02-04-2025 16:37:23

Technical Document

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