SDF5050AB-1 Epoxy Resin

EPOXY RESINS

SDF5050AB-1 Epoxy Resin

SDF5050AB-1 is a black epoxy resin encapsulant designed for potting, insulation, and moisture protection of electronic components.It cures at room or low temperatures and offers excellent flow characteristics along with natural defoaming properties, making it ideal for a variety of electronic encapsulation applications.

Description and Application

This resin provides high dielectric strength, thermal conductivity, and long-term durability—ensuring extended performance and protection of sensitive components such as relays, sensors, and control modules. It can be used for both potting and molding processes.

Applications

Electronic Component Potting: Used for insulating and protecting electronic parts against moisture and environmental damage.
Power Module Encapsulation: Improves insulation and mechanical durability of power units.
Sensor & Relay Modules: Ideal for encapsulating sensors, relays, and control circuits.
Mold Infusion: Suitable for mold-based processing in electronic encapsulation.

Technical Specifications

Property	Value
Hardness (Shore D)	78–83
Dielectric Strength (KV/mm)	22
Flexural Strength (Kg/mm²)	23
Volume Resistivity (Ohm·cm³)	1 × 10¹⁵
Surface Resistivity (Ohm·cm²)	5 × 10¹⁵
Thermal Conductivity (W/m·K)	0.60
Dielectric Loss (1 kHz)	0.42
Operating Temperature Range (°C)	-50 to 140
Water Absorption (%)	<0.15
Compressive Strength (Kg/mm²)	11.3

Packaging
Delivered with standard secure packaging.

Storage & Shelf Life
Store in a cool, dry location.
Protect from direct sunlight and humidity.

Notes
SDF5050AB-1 Epoxy Resin is the ideal solution for potting and protecting electronic components. Its excellent insulation, flowability, and environmental resistance make it highly reliable for a wide range of applications.
For further technical support or tailored solutions, please contact our team.

Updated on 02-04-2025 16:37:25

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