SDF701AB 5 MIN Epoxy Adhesive

EPOXY RESINS

SDF701AB 5 MIN Epoxy Adhesive

SDF701AB is a fast-curing epoxy adhesive that cures at both room and low temperatures. It is easy to use, offers rapid bonding, strong adhesion, and can also be cured with heat. This adhesive is ideal for bonding metals, electronics, and rigid materials.

Description and Application

SDF701AB 5 MIN Epoxy stands out for its quick-setting capability and strong adhesion. It performs excellently on various substrates including metals, electronic components, and hard surfaces. The adhesive is suitable for mold infusion processes and can also be used for insulating electronic parts, waterproof encapsulation, and privacy masking. It offers high dielectric strength, thermal conductivity, and mechanical durability.

Applications

Metal Bonding: Enables fast and reliable adhesion of metal components.
Electronics Assembly: Provides excellent performance in bonding electronic parts.
Rigid Surface Bonding: Ensures durable adhesion between hard substrates.
Mold Infusion: Suitable for molding and infusion processes.
Encapsulation & Insulation: Ideal for moisture-resistant potting and electrical insulation of components.

Technical Specifications

Property	Value
Hardness (Shore D)	<85
Dielectric Strength (KV/mm)	22
Flexural Strength (Kg/mm²)	24
Volume Resistivity (Ohm·cm³)	1 × 10¹⁵
Surface Resistivity (Ohm·cm²)	5 × 10¹⁵
Thermal Conductivity (W/m·K)	0.61
Dielectric Loss (1 kHz)	0.42
Heat Distortion Temperature (°C)	140
Water Absorption (%)	<0.15
Compressive Strength (Kg/mm²)	12.5

Packaging
Securely delivered with protective packaging.

Storage & Shelf Life
Store in a cool, dry place.
Protect from direct sunlight and moisture.

Notes
SDF701AB 5 MIN Epoxy is the perfect solution for fast-setting, high-strength bonding in industrial and electronic applications.
For more details and project-specific guidance, feel free to contact our team.

Updated on 02-04-2025 16:37:21

Technical Document

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